首页> 外文OA文献 >Electrical and thermal transport in coplanar polycrystalline graphene-hBN heterostructures
【2h】

Electrical and thermal transport in coplanar polycrystalline graphene-hBN heterostructures

机译:共面多晶石墨烯-hBN异质结构中的电和热输运

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

We present a theoretical study of electronic and thermal transport in polycrystalline heterostructures combining graphene (G) and hexagonal boron nitride (hBN) grains of varying size and distribution. By increasing the hBN grain density from a few percent to 100%, the system evolves from a good conductor to an insulator, with the mobility dropping by orders of magnitude and the sheet resistance reaching the MΩ regime. The Seebeck coefficient is suppressed above 40% mixing, while the thermal conductivity of polycrystalline hBN is found to be on the order of 30-120 Wm K. These results, agreeing with available experimental data, provide guidelines for tuning G-hBN properties in the context of two-dimensional materials engineering. In particular, while we proved that both electrical and thermal properties are largely affected by morphological features (e.g., by the grain size and composition), we find in all cases that nanometer-sized polycrystalline G-hBN heterostructures are not good thermoelectric materials.
机译:我们提出了结合石墨烯(G)和六方氮化硼(hBN)晶粒的不同尺寸和分布的多晶异质结构中电子和热传输的理论研究。通过将hBN晶粒密度从几个百分点增加到100%,该系统从良好的导体演变为绝缘体,迁移率下降了几个数量级,并且薄层电阻达到MΩ范围。塞贝克系数在混合的40%以上被抑制,而多晶hBN的热导率约为30-120 WmK。这些结果与可用的实验数据相符,为调整G-hBN特性提供了指导。二维材料工程的背景。特别是,虽然我们证明了电学性质和热学性质都受形态特征(例如受晶粒尺寸和组成的影响)很大,但我们发现在所有情况下纳米级多晶G-hBN异质结构都不是良好的热电材料。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号